Pulse Electrodeposition of Copper in the Presence of a Corrosion Reaction

This study has examined the pulse electrodeposition of copper from a deep eutectic solvent. Pulse plating parameters were selected using methodologies originally developed for aqueous solutions, including constraints arising double layer charging and mass transport effects. Although could be deposited under nearly all conditions, in many instances only partial was observed current efficiencies low. effect greatest at low duty cycles and/or when off-time long. phenomenon attributed to corrosion (comproportionation) reaction occurring off-time. A simple model based on being cathodic control developed. While this explain main effects, it predicted rate that typically higher than observed. variety other models then explored, most plausible one indicating is controlled by slow chemical dissolution step. explained observations predicts that, long periods steady-state conditions are approached, control. Finally, found benzotriazole employed substantially reduce allow obtained.